元器件高低溫測試
邁浦(pu)特恒溫(wen)(wen)(wen)(wen)制(zhi)冷(LNEYA)的液(ye)體溫(wen)(wen)(wen)(wen)度控(kong)(kong)制(zhi)技術,主要(yao)用于(yu)半導體測試中的溫(wen)(wen)(wen)(wen)度測試模擬,具有寬溫(wen)(wen)(wen)(wen)度定(ding)向和(he)高溫(wen)(wen)(wen)(wen)升降,溫(wen)(wen)(wen)(wen)度范圍-85℃~250℃,適(shi)合(he)各種(zhong)測試要(yao)求。LNEYA積極(ji)探索(suo)和(he)研究元(yuan)(yuan)件(jian)(jian)測試系統,致(zhi)力于(yu)解決電(dian)子(zi)元(yuan)(yuan)器件(jian)(jian)中溫(wen)(wen)(wen)(wen)度控(kong)(kong)制(zhi)滯(zhi)后的問題(ti),冷卻技術可(ke)直(zhi)接從300℃進行冷卻。該(gai)產品(pin)適(shi)用于(yu)電(dian)子(zi)元(yuan)(yuan)器件(jian)(jian)的jing確(que)溫(wen)(wen)(wen)(wen)度控(kong)(kong)制(zhi)需求。
在用(yong)于惡劣環境(jing)(jing)的半導體電(dian)子元件的制造中,IC封裝(zhuang)組裝(zhuang)和工程和生產的測(ce)試(shi)階(jie)段包括在溫度(-85℃至+ 250℃)下的電(dian)子冷(leng)熱(re)測(ce)試(shi)和其它環境(jing)(jing)測(ce)試(shi)模擬。